BGA rework, reballing and x-ray services for BGA sockets, adapters, and devices

Products and Services
*Why Go with a BGA Socket and Header?*
*1.27 mm (0.050) BGA Socket Products*
*1.0 mm (.03937) BGA Socket Products*
*PCB, BGA/u'BGA/CSP Rework / Reball Services*
*PCB, BGA /u'BGA/CSP Placement Services*
*BGA Device Converters*
*BGA x-ray Services*
Custom Application Adapters
Application Specific Modules
Direct Device Replacement Modules
*Development Tools*
*Test / Burn-In Sockets*
Engineer/Prototype PCB Assemblies
*PCB Assembly Services*
*PCB Turnkey Assembly*
PCB Design Services BGA 1.00 / 1.27mm
Custom Screw Machine Pins
Wirewrap Board Assemblies
*Chassis System Assembly*
*PLCC Sockets*

Rework: BGA Rework, Attachment, Reballing

Pace TF 2000 BGA / CSP Rework System

Reworking of BGA devices on PCB surface begins with the right equipment.
Adapter Technologies utilizes the Pace TF 2000 BGA/CSP Rework System for all
BGA rework, detachment and reattachment of devices. All work involving BGA devices are then fully X-rayed after attachment. Utilizing the latest in opticle alignment software on the Pace TF 2000 ensures precise alignment of BGA device
to PCB footprint, including 1mm (FBGA) devices. Devices can be dettached, attached or rework on either populated or unpopulated boards.